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IPC-4101 Laminate Prepreg Materials Standard for Printed Boards.IPC-4562 Metal Foil for Printed Wiring Applications.IPC-FC-234 Pressure Sensitive Adhesives Assembly Guidelines for Single-Sided and Double-Sided Flexible Printed Circuits.IPC-7351B Generic Requirements for Surface Mount Design and Land Pattern Standards.IPC-2251 Design Guide for the Packaging of High Speed Electronic Circuit.IPC-2223 Sectional Design Standard for Flexible Printed Boards.IPC-2221 Generic Standard on Printed Board Design.IPC-2141A Design Guide for High-Speed Controlled Impedance Circuit Boards.
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IPC-2612 Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions).IPC-ET-652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards.IPC-A-31 Flexible Raw Material Test Pattern.IPC-D-325 Documentation Requirements for Printed Boards.IPC-2615 Printed Board Dimensions and Tolerances.in the United States, and overseas offices in China, Thailand, Vietnam, India and Belgium. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. It publishes the most widely used acceptability standards in the electronics industry. IPC is accredited by the American National Standards Institute (ANSI) as a standards developing organization and is known globally for its standards. In 1999, the organization formally changed its name to IPC with the accompanying tagline, Association Connecting Electronics Industries. Its name was later changed to the Institute for Interconnecting and Packaging Electronic Circuits to highlight the expansion from bare boards to packaging and electronic assemblies. It was founded in 1957 as the Institute of Printed Circuits. IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. Institute of Printed Circuits, Institute for Interconnecting and Packaging Electronic Circuits
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